STEC, Inc.

City:

Country:

United States

Published Applications:

Last publication date:

2013-08-29

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STEC, Inc. from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

Systems and methods of using dynamic data for wear leveling in solid-state devices

Determining bias information for offsetting operating variations in memory cells based on wordline address

Reduced complexity non-binary LDPC decoding algorithm

InventorID:

394384 ⎘