Matthew Romig

City:

Richardson, Texas

Country:

United States

Published Applications:

Last publication date:

2009-05-21

Recent patent applications by Romig Matthew

Matthew Romig from Richardson, US has applied for patents for these inventions. The list has both pending applications and granted patents:

THERMAL CONDUCTOR LIDS FOR AREA ARRAY PACKAGED MULTI-CHIP MODULES AND METHODS TO DISSIPATE HEAT FROM MULTI-CHIP MODULES

Thermally Enhanced BGA Package Substrate Structure and Methods

InventorID:

3948197 ⎘