Martin Demmig

City:

Quickborn

Country:

Germany

Published Applications:

Last publication date:

2023-02-16

Top Assignees for applications by Martin Demmig

The entities that hold a legal rights for patent applications filed by inventor Demmig Martin:

SIKA TECHNOLOGY AG 8 Baar, Switzerland

Recent patent applications by Demmig Martin

Martin Demmig from Quickborn, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-02-16

US20230047357A1

Chemistry; metallurgy

TWO-COMPONENT POLYURETHANE COMPOSITION WITH A HIGH DEGREE OF HYDROPHOBICITY AND ADJUSTABLE POT LIFE

#2 | 2021-09-23

US20210292621A1

Chemistry; metallurgy

Structural polyurethane adhesive having good adhesion after short-duration heating

#3 | 2021-06-24

US20210189205A1

Chemistry; metallurgy

ADHESIVE BOND BETWEEN A THERMOPLASTIC MATERIAL AND AN ELASTOMER COMPOSITION

#4 | 2020-08-06

US20200248041A1

Chemistry; metallurgy

ACTIVATOR FOR ACCELERATED ADHESION DEVELOPMENT

#5 | 2016-01-14

US20160010456A1

Fixed constructions

METHOD FOR PRODUCING A TUBBING HAVING A THERMOPLASTIC SEALING LAYER

#6 | 2013-08-22

US20130212968A1

Fixed constructions

Use of dispersion adhesive-coated polyvinyl chloride sealing films for producing a seal

#7 | 2012-10-11

US20120258317A1

Chemistry; metallurgy

Aqueous two-component dispersion adhesive

#8 | 2011-02-17

US20110039107A1

Chemistry; metallurgy

FILM PRIMER WITH IMPROVED ADHESION

#9 | 2009-01-15

US20090017310A1

Chemistry; metallurgy

Aqueous one-component dispersion primer for the adhesion of plastic films by means of dispersion adhesives

InventorID:

395252 ⎘