Henry Lo

System and method for enhanced control of copper trench sheet resistance uniformity

Method and system for controlling copper chemical mechanical polish uniformity

Prediction of uniformity of a wafer

Automatic virtual metrology for semiconductor wafer result prediction

System for extraction of key process parameters from fault detection classification to enable wafer prediction

Integrated etch and supercritical COprocess and chamber design

Integrated circuit devices with multi-dimensional pad structures

Method for forming dual damascenes with supercritical fluid treatments

Three-dimensional integrated circuit structure

Method to implement stress free polishing

Method for improving low-K dielectrics by supercritical fluid treatments

Method and composition to improve a nitride/oxide wet etching selectivity

Micro-etching method to replicate alignment marks for semiconductor wafer photolithography

FIB exposure of alignment marks in MIM technology

Advanced process control approach for Cu interconnect wiring sheet resistance control

Planarizing method employing hydrogenated silicon nitride planarizing stop layer

Method and system for in-situ monitoring of mixing ratio of high selectivity slurry

Application of a supercritical CO2 system for curing low k dielectric materials