Ossining, New York
United States
18
2009-12-10
The entities that hold a legal rights for patent applications filed by inventor Gates Stephen McConnell:
Stephen McConnell Gates from Ossining, US has applied for patents for these inventions. The list has both pending applications and granted patents:
ULTRALOW DIELECTRIC CONSTANT LAYER WITH CONTROLLED BIAXIAL STRESS
#2 | 2009-12-03ULTRA LOW K (ULK) SiCOH FILM AND METHOD
#3 | 2009-06-11Ultra low Îș plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality
#4 | 2008-12-18Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics
#5 | 2008-11-20ULTRALOW DIELECTRIC CONSTANT LAYER WITH CONTROLLED BIAXIAL STRESS
#6 | 2008-02-21Ultralow dielectric constant layer with controlled biaxial stress
#7 | 2008-02-14Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics
#8 | 2008-01-31ULTRA LOW K (ULK) SiCOH FILM AND METHOD
#9 | 2007-10-11DIFFUSION BARRIER WITH LOW DIELECTRIC CONSTANT AND SEMICONDUCTOR DEVICE CONTAINING SAME
#10 | 2007-08-07Diffusion barrier with low dielectric constant and semiconductor device containing same
#11 | 2006-07-13Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics
#12 | 2006-04-13Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality
#13 | 2005-12-15Ultra low k (ULK) SiCOH film and method
#14 | 2005-10-25Electronic structures with reduced capacitance
#15 | 2005-09-22Method of forming a ceramic diffusion barrier layer
#16 | 2005-09-13Semiconductor devices containing a discontinuous cap layer and methods for forming same
#17 | 2005-08-25Structures and methods for integration of ultralow-k dielectrics with improved reliability
#18 | 2005-04-28Interconnect structures incorporating low-k dielectric barrier films
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