Kevin A. Dore

City:

Fishkill, New York

Country:

United States

Published Applications:

Last publication date:

2009-06-18

Top Assignees for applications by Kevin A. Dore

The entities that hold a legal rights for patent applications filed by inventor Dore Kevin A.:

Kevin A. Dore from Fishkill, US has applied for patents for these inventions. The list has both pending applications and granted patents:

IC CHIP PACKAGE SUBSTRATE HAVING OUTERMOST GLASS FIBER REINFORCED EPOXY LAYERS AND RELATED METHOD

InventorID:

3969488 ⎘