Berlin
Germany
6
2022-04-14
The entities that hold a legal rights for patent applications filed by inventor KLEIN Matthias:
Matthias KLEIN from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Method for forming packaged semiconductor die with micro-cavity
#2 | 2021-04-15Packaged semiconductor die with micro-cavity
#3 | 2013-08-22METHOD FOR JOINING A FIRST ELECTRONIC COMPONENT AND A SECOND COMPONENT
#4 | 2012-02-16Component arrangement and method for production thereof
#5 | 2008-04-24Flip chip metallization method and devices
#6 | 2008-01-24In vivo implantable coil assembly
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