Ming Cheng LI

City:

Cincinnati, Ohio

Country:

United States

Published Applications:

Last publication date:

2009-06-25

Top Assignees for applications by Ming Cheng LI

The entities that hold a legal rights for patent applications filed by inventor LI Ming Cheng:

GENERAL ELECTRIC COMPANY 2 Schenectady, NY United States

Recent patent applications by LI Ming Cheng

Ming Cheng LI from Cincinnati, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-06-25

US20090159161A1

Performing operations; transporting

METHOD FOR FABRICATING A THICK Ti64 ALLOY ARTICLE TO HAVE A HIGHER SURFACE YIELD AND TENSILE STRENGTHS AND A LOWER CENTERLINE YIELD AND TENSILE STRENGTHS

#2 | 2005-04-28

US20050087272A1

Performing operations; transporting

Method for fabricating a thick Ti64 alloy article to have a higher surface yield and tensile strengths and a lower centerline yield and tensile strengths

InventorID:

3972373 ⎘