William E. Sablinski

City:

Beacon, New York

Country:

United States

Published Applications:

Last publication date:

2009-07-16

Top Assignees for applications by William E. Sablinski

The entities that hold a legal rights for patent applications filed by inventor Sablinski William E.:

INTERNATIONAL BUSINESS MACHINES CORPORATION 4 ARMONK, NY United States
Tessera Intellectual Properties, Inc. 1 San Jose, CA United States

Recent patent applications by Sablinski William E.

William E. Sablinski from Beacon, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-07-16

US20090182161A1

Chemistry; metallurgy

Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system

#2 | 2009-06-25

US20090163019A1

Electricity

Forming robust solder interconnect structures by reducing effects of seed layer underetching

#3 | 2006-01-12

US20060009022A1

Electricity

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

#4 | 2005-09-22

US20050208748A1

Electricity

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

InventorID:

3975028 ⎘