David E. Eichstadt

City:

Park Ridge, Illinois

Country:

United States

Published Applications:

Last publication date:

2009-06-25

Top Assignees for applications by David E. Eichstadt

The entities that hold a legal rights for patent applications filed by inventor Eichstadt David E.:

INTERNATIONAL BUSINESS MACHINES CORPORATION 5 ARMONK, NY United States
Tessera Intellectual Properties, Inc. 1 San Jose, CA United States

Recent patent applications by Eichstadt David E.

David E. Eichstadt from Park Ridge, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-06-25

US20090163019A1

Electricity

Forming robust solder interconnect structures by reducing effects of seed layer underetching

#2 | 2006-11-09

US20060249854A1

Electricity

Device with area array pads for test probing

#3 | 2006-01-12

US20060009022A1

Electricity

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

#4 | 2005-11-03

US20050245070A1

Electricity

Barrier for interconnect and method

#5 | 2005-09-22

US20050208748A1

Electricity

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

#6 | 2005-08-04

US20050167837A1

Electricity

DEVICE WITH AREA ARRAY PADS FOR TEST PROBING

InventorID:

3975030 ⎘