Howard Smith

City:

Beacon, New York

Country:

United States

Published Applications:

Last publication date:

2009-06-25

Top Assignees for applications by Howard Smith

The entities that hold a legal rights for patent applications filed by inventor Smith Howard:

Howard Smith from Beacon, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Methodology for Thermal Modeling of On-Chip Interconnects Based on Electromagnetic Simulation Tools

InventorID:

3975969 ⎘