Tecumseh, Michigan
United States
12
2019-11-21
The entities that hold a legal rights for patent applications filed by inventor Bennett Daniel:
Daniel Bennett from Tecumseh, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Window assembly with solderless electrical connector
#2 | 2019-08-06Window assembly with solderless electrical connector
#3 | 2018-05-03Encapsulated glass frame assemblies and associated methods for forming same
#4 | 2018-05-03Encapsulated glass frame assemblies and associated methods for forming same
#5 | 2018-03-20Encapsulated glass frame assemblies and associated methods for forming same
#6 | 2017-08-17Sliding window assembly
#7 | 2015-10-22Sliding window assembly
#8 | 2015-08-27Encapsulants for window assemblies
#9 | 2014-10-16Encapsulants for window assemblies
#10 | 2014-07-03Encapsulants for window assemblies
#11 | 2014-04-17Encapsulants for window assemblies
#12 | 2013-08-22Adhesively bonded window and hardware assembly
397983 ⎘