Eddic Acosta

City:

Martindale, Texas

Country:

United States

Published Applications:

Last publication date:

2009-07-02

Top Assignees for applications by Eddic Acosta

The entities that hold a legal rights for patent applications filed by inventor Acosta Eddic:

Eddic Acosta from Martindale, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Forming a 3-D semiconductor die structure with an intermetallic formation

InventorID:

3980245 ⎘