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Inventor profile of:

Manfred Riedler

City:

Country:

United States

Published Applications:

1

Last publication date:

2009-07-23

Recent patent applications by Riedler Manfred

Manfred Riedler from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-07-23

US20090184090A1

THIN-FILM ASSEMBLY AND METHOD FOR PRODUCING SAID ASSEMBLY

InventorID:

3990570 ⎘