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Inventor profile of:

KATOH Takeo

City:

Tokyo

Country:

Japan

Published Applications:

1

Last publication date:

2009-07-23

Recent patent applications by Takeo KATOH

KATOH Takeo from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-07-23

US20090186488A1

SINGLE WAFER ETCHING APPARATUS

InventorID:

3992199 ⎘