Hideki Matsui

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2024-05-16

Top Assignees for applications by Hideki Matsui

The entities that hold a legal rights for patent applications filed by inventor Matsui Hideki:

Hideki Matsui from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

WIRING CIRCUIT BOARD

WIRING CIRCUIT BOARD

Method of beautification and facelifting using a stretch tape

Method of beautification and facelifting using a stretch tape

Preventives/remedies for neurodegenerative diseases

Electromagnetic wave blocking material and electromagnetic wave blocking case

InventorID:

3992784 ⎘