Ryuichi ISHIDA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2021-12-30

Top Assignees for applications by Ryuichi ISHIDA

The entities that hold a legal rights for patent applications filed by inventor ISHIDA Ryuichi:

Ryuichi ISHIDA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Resin panel, structure, and method for manufacturing same

Foamed structure, resin panel, method of manufacturing resin panel, method of manufacturing resin laminated body and foamed body

Method for producing duct-integrated floor-raising material

Molded foam

InventorID:

401443 ⎘