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Inventor profile of:

Nan-Chun Lin

City:

Country:

United States

Published Applications:

1

Last publication date:

2009-09-10

Recent patent applications by Lin Nan-Chun

Nan-Chun Lin from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-09-10

US20090227048A1

METHOD FOR DIE BONDING HAVING PICK-AND-PROBING FEATURE

InventorID:

4022217 ⎘