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Inventor profile of:

Hsiang-Ming HUANG

City:

Country:

United States

Published Applications:

2

Last publication date:

2009-11-19

Recent patent applications by HUANG Hsiang-Ming

Hsiang-Ming HUANG from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-11-19

US20090283905A1

CONDUCTIVE STRUCTURE OF A CHIP

#2 | 2009-09-24

US20090236741A1

CONDUCTIVE STRUCTURE OF A CHIP AND METHOD FOR MANUFACTURING THE SAME

InventorID:

4028972 ⎘