Heng-I Lin

City:

Country:

United States

Published Applications:

Last publication date:

2009-10-01

Top Assignees for applications by Heng-I Lin

The entities that hold a legal rights for patent applications filed by inventor Lin Heng-I:

Heng-I Lin from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for packaging a light emitting device including a metal reflection layer and a metal heat dissipation layer

InventorID:

4033235 ⎘