David Danowski

City:

Brookfield, Wisconsin

Country:

United States

Published Applications:

Last publication date:

2009-10-08

Top Assignees for applications by David Danowski

The entities that hold a legal rights for patent applications filed by inventor Danowski David:

David Danowski from Brookfield, US has applied for patents for these inventions. The list has both pending applications and granted patents:

WRAPPING PAPER

InventorID:

4037706 ⎘