Barry C. Snyder

City:

Bend, Oregon

Country:

United States

Published Applications:

Last publication date:

2009-10-15

Top Assignees for applications by Barry C. Snyder

The entities that hold a legal rights for patent applications filed by inventor Snyder Barry C.:

Barry C. Snyder from Bend, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Bonded structures formed by plasma enhanced bonding

Conductive trace formation via wicking action

Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding

Method of forming a through-substrate interconnect

Method of forming a through-substrate interconnect

InventorID:

4042595 ⎘