William E. Murphy

City:

Vestal, New York

Country:

United States

Published Applications:

Last publication date:

2009-10-29

Top Assignees for applications by William E. Murphy

The entities that hold a legal rights for patent applications filed by inventor Murphy William E.:

William E. Murphy from Vestal, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Plastic ball grid array ruggedization

Reliability enhancement process

Enhanced reliability semiconductor package

InventorID:

4049669 ⎘