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Inventor profile of:

Daisuke Itoh

City:

Ibaraki

Country:

Japan

Published Applications:

6

Last publication date:

2009-10-29

Top Assignees for applications by Daisuke Itoh

The entities that hold a legal rights for patent applications filed by inventor Itoh Daisuke:

KUREHA CORPORATION 2 Tokyo, Japan
HARIMA CHEMICALS, INC. 2 Hyogo, Japan
National Institute of Advanced Industrial Science 1 Tokyo, Japan
SIJ Technology, Inc. 1 Tsukuba, Japan
Toshiba Corporation 1 Tokyo, Japan
HARIMA CHEMICALS, INC. 1 Kakogawa-shi, Japan
National Institute of Advanced Industrial Science and Technology 1 Tokyo, Japan
Harima Chemicals, Inc. 1 Kakogwa-shi, Japan

Recent patent applications by Itoh Daisuke

Daisuke Itoh from Ibaraki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-10-29

US20090269526A1

Performing operations; transporting

Multilayer blow molded container and production process thereof

#2 | 2007-09-27

US20070224375A1

Performing operations; transporting

Multi-layered biaxial stretch blow molded bottle and method for production thereof

#3 | 2007-05-03

US20070098883A1

Metal nanoparticle dispersion usable for ejection in the form of fine droplets to be applied in the layered shape

#4 | 2006-12-21

US20060286301A1

Performing operations; transporting

Substrates and method of manufacturing same

#5 | 2006-09-21

US20060210705A1

Method for forming fine copper particle sintered product type of electric conductor having fine shape, and process for forming copper fine wiring and thin copper film by applying said method

#6 | 2006-02-23

US20060038304A1

Conductive adhesive agent with ultrafine particles

InventorID:

4051044 ⎘