ORONOCO, Minnesota
United States
38
2016-11-03
The entities that hold a legal rights for patent applications filed by inventor GERMANN PHILIP R.:
PHILIP R. GERMANN from ORONOCO, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Residual material detection in backdrilled stubs
#2 | 2015-11-26Residual material detection in backdrilled stubs
#3 | 2015-11-26Residual material detection in backdrilled stubs
#4 | 2015-06-11Intelligent chip placement within a three-dimensional chip stack
#5 | 2015-06-11Intelligent chip placement within a three-dimensional chip stack
#6 | 2015-01-29Donor cores to improve integrated circuit yield
#7 | 2014-06-19Interconnect solder bumps for die testing
#8 | 2013-10-24Implementing semiconductor signal-capable capacitors with deep trench and TSV technologies
#9 | 2013-09-26Implementing memory interface with configurable bandwidth
#10 | 2013-09-12Implementing selective rework for chip stacks and silicon carrier assemblies
#11 | 2013-08-29IMPLEMENTING INTERLEAVED-DIELECTRIC JOINING OF MULTI-LAYER LAMINATES
#12 | 2013-01-03Through silicon via direct FET signal gating
#13 | 2012-08-23Field-effect transistor and method of creating same
#14 | 2012-06-14Power domain controller with gated through silicon via having FET with horizontal channel
#15 | 2012-03-15Implementing interleaved-dielectric joining of multi-layer laminates
#16 | 2011-09-29Sorting movable memory hierarchies in a computer system
#17 | 2010-02-04Continuity check monitoring for microchip exploitation detection
#18 | 2010-02-04Signal quality monitoring to defeat microchip exploitation
#19 | 2010-02-04Capacitance-based microchip exploitation detection
#20 | 2010-02-04Interdependent Microchip Functionality for Defeating Exploitation Attempts
#21 | 2010-02-04False connection for defeating microchip exploitation
#22 | 2010-02-04Resistance sensing for defeating microchip exploitation
#23 | 2010-02-04Capacitance structures for defeating microchip tampering
#24 | 2010-02-04SHIELDED WIREBOND
#25 | 2010-02-04Doped implant monitoring for microchip tamper detection
#26 | 2009-12-10System and Method for Thermal Optimized Chip Stacking
#27 | 2009-07-16Techniques for providing switchable decoupling capacitors for an integrated circuit
#28 | 2009-03-26Method and structure for dispensing chip underfill through an opening in the chip
#29 | 2009-03-05METHOD AND APPARATUS TO TEST ELECTRICAL CONTINUITY AND REDUCE LOADING PARASITICS ON HIGH-SPEED SIGNALS
#30 | 2009-03-05BIMETALLIC HEAT SINK AIR DEFLECTORS FOR DIRECTED AIRFLOW FOR IMPROVED THERMAL TRANSFER AND DISSIPATION
#31 | 2009-02-26System and method for implementing optimized creation of openings for de-gassing in an electronic package
#32 | 2009-01-29Spider web interconnect topology utilizing multiple port connection
#33 | 2008-11-06METHOD AND COMPUTER PROGRAM FOR AUTOMATED ASSIGNMENT AND INTERCONNECTION OF DIFFERENTIAL PAIRS WITHIN AN ELECTRONIC PACKAGE
#34 | 2008-07-24Structure for multi-level memory architecture with data prioritization
#35 | 2008-06-26Using common mode differential data signals of DDR2 SDRAM for control signal transmission
#36 | 2008-01-17Dynamic latency map for memory optimization
#37 | 2008-01-17Multi-level memory architecture with data prioritization
#38 | 2007-11-15Using common mode differential data signals of DDR2 SDRAM for control signal transmission
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