ZUMBROTA, Minnesota
United States
133
2023-06-08
The entities that hold a legal rights for patent applications filed by inventor SHEETS, II JOHN E.:
JOHN E. SHEETS, II from ZUMBROTA, US has applied for patents for these inventions. The list has both pending applications and granted patents:
PROCESSOR CHIP TIMING ADJUSTMENT ENHANCEMENT
#2 | 2020-05-28Negative operand compatible charge-scaling subtractor circuit
#3 | 2020-04-23Charge-scaling multiplier circuit with digital-to-analog converter
#4 | 2020-04-23Charge-scaling multiplier circuit with dual scaled capacitor sets
#5 | 2020-03-17Charge-scaling multiplier circuit
#6 | 2020-01-09Low resistance contact for transistors
#7 | 2019-12-26Charge-scaling subtractor circuit
#8 | 2019-12-26Charge-scaling adder circuit
#9 | 2019-11-28Semiconductor device and method of forming the semiconductor device
#10 | 2019-11-14Managed integrated circuit power supply distribution
#11 | 2019-11-05Low resistance contact for transistors
#12 | 2019-07-30Charge-scaling subtractor circuit
#13 | 2019-07-09Charge-scaling adder circuit
#14 | 2019-05-16Managed integrated circuit power supply distribution
#15 | 2019-01-03Metalization repair in semiconductor wafers
#16 | 2018-12-06Through-substrate via power gating and delivery bipolar transistor
#17 | 2018-12-06Through-substrate via power gating and delivery bipolar transistor
#18 | 2018-12-06Optimizing data approximation analysis using low power circuitry
#19 | 2018-12-06Optimizing data approximation analysis using low bower circuitry
#20 | 2018-12-06Real time cognitive reasoning using a circuit with varying confidence level alerts
#21 | 2018-12-06Real time cognitive reasoning using a circuit with varying confidence level alerts
#22 | 2018-12-06Real time cognitive monitoring of correlations between variables
#23 | 2018-12-06Cognitive analysis using applied analog circuits
#24 | 2018-12-06Real time cognitive monitoring of correlations between variables
#25 | 2018-12-06Cognitive analysis using applied analog circuits
#26 | 2018-08-23Predicting data correlation using multivalued logical outputs in static random access memory (SRAM) storage cells
#27 | 2018-08-23Optimizing data approximation analysis using low power circuitry
#28 | 2018-08-07Optimizing data approximation analysis using low power circuitry
#29 | 2018-08-02Method for low power operation and test using DRAM device
#30 | 2018-07-31Optimizing data approximation analysis using low power circuitry
#31 | 2018-06-07Method of optimizing wire RC for device performance and reliability
#32 | 2018-05-31Generating a unique die identifier for an electronic chip
#33 | 2018-05-24Integrated shielding and decoupling capacitor structure
#34 | 2018-05-03Semiconductor device and method of forming the semiconductor device
#35 | 2018-04-05Metalization repair in semiconductor wafers
#36 | 2018-04-05Semiconductor device and method of forming the semiconductor device
#37 | 2018-04-05METALIZATION REPAIR IN SEMICONDUCTOR WAFERS
#38 | 2018-03-13Predicting data correlation using multivalued logical outputs in static random access memory (SRAM) storage cells
#39 | 2018-01-09Generating a unique die identifier for an electronic chip
#40 | 2017-11-30Enhancing performance of one or more slower partitions of an integrated circuit to improve performance of the integrated circuit
#41 | 2017-08-17Implementing eFuse visual security of stored data using EDRAM
#42 | 2017-07-18Dynamic noise mitigation in integrated circuit devices using local clock buffers
#43 | 2017-06-15System for testing charge trap memory cells
#44 | 2017-06-15System for testing charge trap memory cells
#45 | 2017-05-25Implementing eFuse visual security of stored data using EDRAM
#46 | 2017-04-06Method of optimizing wire RC for device performance and reliability
#47 | 2017-03-07Multiple FET non-volatile memory with default logical state
#48 | 2016-12-29FinFET power supply decoupling
#49 | 2016-12-29Implementing resistance defect performance mitigation using test signature directed self heating and increased voltage
#50 | 2016-12-29Implementing resistance defect performance mitigation using test signature directed self heating and increased voltage
#51 | 2016-12-13Power gating and clock gating in wiring levels
#52 | 2016-12-06Implementing eFuse visual security of stored data using EDRAM
#53 | 2016-11-15High-density integrated circuit via capacitor
#54 | 2016-09-27High-density integrated circuit via capacitor
#55 | 2016-09-27Decoupling capacitor using finFET topology
#56 | 2016-08-23Detection of initial state by eFuse array
#57 | 2016-08-02Bias-temperature induced damage mitigation circuit
#58 | 2016-07-26Bias-temperature induced damage mitigation circuit
#59 | 2016-06-23Implementing hidden security key in eFuses
#60 | 2016-06-23Implementing hidden security key in eFuses
#61 | 2016-06-23Sensing of non-volatile memory cell having two complementary memory transistors
#62 | 2016-06-23Sensing circuit for a non-volatile memory cell having two complementary memory transistors
#63 | 2016-06-16Structure for metal oxide semiconductor capacitor
#64 | 2016-05-26PRECISION INTRALEVEL METAL CAPACITOR FABRICATION
#65 | 2016-05-26PRECISION INTRALEVEL METAL CAPACITOR FABRICATION
#66 | 2016-01-26Structure for metal oxide semiconductor capacitor
#67 | 2015-08-13Side gate assist in metal gate first process
#68 | 2015-07-23IMPLEMENTING BURIED FET BELOW AND BESIDE FINFET ON BULK SUBSTRATE
#69 | 2015-06-11Semiconductor chip with power gating through silicon vias
#70 | 2015-06-04Implementing buried FET below and beside FinFET on bulk substrate
#71 | 2015-06-04Method of implementing buried FET below and beside FinFET on bulk substrate
#72 | 2015-05-28Implementing buried FET utilizing drain of finFET as gate of buried FET
#73 | 2015-05-07Signal transmission reducing coupling caused delay variation
#74 | 2015-03-19Interdigitated finFETs
#75 | 2015-01-08Method of making semiconductor device with distinct multiple-patterned conductive tracks on a same level
#76 | 2015-01-08Semiconductor device with distinct multiple-patterned conductive tracks on a same level
#77 | 2014-12-30Precision IC resistor fabrication
#78 | 2014-12-11Capacitor backup for SRAM
#79 | 2014-12-11Capacitor backup for SRAM
#80 | 2014-09-18Multiple-patterned semiconductor device channels
#81 | 2014-09-18Semiconductor device channels
#82 | 2014-09-18Semiconductor device channels
#83 | 2014-09-18Multiple-patterned semiconductor device channels
#84 | 2014-09-18Semiconductor device channels
#85 | 2014-09-18Semiconductor device channels
#86 | 2014-09-18Semiconductor chip with power gating through silicon vias
#87 | 2014-07-31Method for implementing deep trench enabled high current capable bipolar transistor for current switching and output driver applications
#88 | 2014-07-03Signal path and method of manufacturing a multiple-patterned semiconductor device
#89 | 2014-07-03Signal path of a multiple-patterned semiconductor device
#90 | 2014-07-03Signal path of a multiple-patterned semiconductor device
#91 | 2014-07-03Signal path and method of manufacturing a multiple-patterned semiconductor device
#92 | 2014-07-03GATELESS FINFET
#93 | 2014-07-03Signal path and method of manufacturing a multiple-patterned semiconductor device
#94 | 2014-06-17Semiconductor chip with power gating through silicon vias
#95 | 2014-06-05Implementing enhanced power supply distribution and decoupling utilizing TSV exclusion zone
#96 | 2014-05-08Integrated decoupling capacitor utilizing through-silicon via
#97 | 2014-05-08Integrated decoupling capacitor utilizing through-silicon via
#98 | 2013-12-26FinFET with body contact
#99 | 2013-12-26Implementing gate within a gate utilizing replacement metal gate process
#100 | 2013-12-12IMPLEMENTING ISOLATED SILICON REGIONS IN SILICON-ON-INSULATOR (SOI) WAFERS USING BONDED-WAFER TECHNIQUE
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