BENQ MATERIALS CORP.

City:

Country:

United States

Published Applications:

Last publication date:

2013-08-29

Top Assignees for applications by BENQ MATERIALS CORP.

The entities that hold a legal rights for patent applications filed by inventor BENQ MATERIALS CORP.:

BENQ MATERIALS CORP. from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of Fabricating Bubble-Type Micro-Pump

InventorID:

408302 ⎘