Irvine, California
United States
62
2015-11-19
The entities that hold a legal rights for patent applications filed by inventor Chen Xiangdong:
Xiangdong Chen from Irvine, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Standard cell architecture with M1 layer unidirectional routing
#2 | 2015-10-22MASK ASSIGNMENT TECHNIQUE FOR M1 METAL LAYER IN TRIPLE-PATTERNING LITHOGRAPHY
#3 | 2015-10-22Variable interconnect pitch for improved performance
#4 | 2015-09-03High performance standard cell with continuous oxide definition and characterized leakage current
#5 | 2015-08-20Grounding dummy gate in scaled layout design
#6 | 2015-08-06Digital circuit design with semi-continuous diffusion standard cell
#7 | 2015-07-09Conductive layer routing
#8 | 2015-04-23SCALABLE INTEGRATED MIM CAPACITOR USING GATE METAL
#9 | 2014-09-18Metal-insulator-metal (MIM) capacitor
#10 | 2014-06-05Stacked packaging using reconstituted wafers
#11 | 2014-02-20FinFET based one-time programmable device
#12 | 2014-02-06Method of fabricating a flash memory comprising a high-K dielectric and a metal gate
#13 | 2013-11-21Decoupling composite capacitor in a semiconductor wafer
#14 | 2013-11-14One-time programmable device
#15 | 2013-11-14LDMOS one-time programmable device
#16 | 2013-10-31Zener diode structure and process
#17 | 2013-08-29Semiconductor package with integrated selectively conductive film interposer
#18 | 2013-08-29Semiconductor packages with integrated heat spreaders
#19 | 2013-08-29System-in-package with integrated socket
#20 | 2013-08-29Semiconductor package with integrated electromagnetic shielding
#21 | 2013-08-01Semiconductor package with improved testability
#22 | 2013-08-01Semiconductor package having an interposer configured for magnetic signaling
#23 | 2013-08-01Structure and method for making low leakage and low mismatch NMOSFET
#24 | 2013-07-18Semiconductor interposer having a cavity for intra-interposer die
#25 | 2013-07-04Semiconductor package with ultra-thin interposer without through-semiconductor vias
#26 | 2013-07-04Semiconductor package with a bridge interposer
#27 | 2013-07-04Programmable interposer with conductive particles
#28 | 2013-06-20Stacked Packaging Using Reconstituted Wafers
#29 | 2013-05-02FinFET devices
#30 | 2013-04-25Fin-based adjustable resistor
#31 | 2013-04-11MOM capacitor having local interconnect metal plates and related method
#32 | 2013-04-04MIM capacitor having a local interconnect metal electrode and related structure
#33 | 2013-04-04One time programmable structure using a gate last high-K metal gate process
#34 | 2013-04-04Zener diode structure and process
#35 | 2013-04-04One-time programmable device having an LDMOS structure
#36 | 2013-03-28Fin-based bipolar junction transistor and method for fabrication
#37 | 2013-03-14Half-FinFET semiconductor device and related method
#38 | 2013-02-28FinFET based one-time programmable device and related method
#39 | 2013-01-17Method for fabricating a MOS transistor with reduced channel length variation
#40 | 2013-01-10Method for efficiently fabricating memory cells with logic FETs and related structure
#41 | 2013-01-03Transistor with reduced channel length variation
#42 | 2012-11-22Combined Substrate High-K Metal Gate Device and Oxide-Polysilicon Gate Device, and Process of Fabricating Same
#43 | 2012-08-30Programmable fuse
#44 | 2012-02-16One-time programmable memory cell
#45 | 2012-02-16Programmable memory cell with shiftable threshold voltage transistor
#46 | 2011-09-01One-time programmable semiconductor device
#47 | 2011-09-01Integrated native device without a halo implanted channel region and method for its fabrication
#48 | 2011-09-01Scalable integrated MIM capacitor using gate metal
#49 | 2011-08-18Integrated resistor using gate metal for a resistive element
#50 | 2011-08-04Low mismatch semiconductor device and method for fabricating same
#51 | 2011-08-04Semiconductor device having a lightly doped semiconductor gate and method for fabricating same
#52 | 2011-07-21Structure and method for making low leakage and low mismatch NMOSFET
#53 | 2011-05-12Method for fabricating a flash memory cell utilizing a high-K metal gate process and related structure
#54 | 2011-04-21Method for fabricating a MOS transistor with reduced channel length variation and related structure
#55 | 2011-04-07Interposer structure with passive component and method for fabricating same
#56 | 2011-03-03Method for fabricating a MOS transistor with source/well heterojunction and related structure
#57 | 2011-02-17Method for fabricating a decoupling composite capacitor in a wafer and related structure
#58 | 2011-02-10One-time programmable memory cell with shiftable threshold voltage transistor
#59 | 2011-02-10Method for fabricating a MIM capacitor using gate metal for electrode and related structure
#60 | 2010-12-23Method for forming a one-time programmable metal fuse and related structure
#61 | 2010-12-16Method for selective gate halo implantation in a semiconductor die and related structure
#62 | 2010-11-11One-time programmable memory cell
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