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Inventor profile of:

Jun Shirakami

City:

Osaka

Country:

Japan

Published Applications:

19

Last publication date:

2019-03-07

Top Assignees for applications by Jun Shirakami

The entities that hold a legal rights for patent applications filed by inventor Shirakami Jun:

DIC Corporation 13 Tokyo, Japan
DIC Corporation 1 Itabashi-ku, Japan

Recent patent applications by Shirakami Jun

Jun Shirakami from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-03-07

US20190070631A1

Performing operations; transporting

METHOD FOR MANUFACTURING LAMINATE

#2 | 2018-07-19

US20180206368A1

CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD, AND METHOD FOR PRODUCING CONDUCTIVE PATTERN

#3 | 2018-06-14

US20180162106A1

Performing operations; transporting

LAMINATED BODY, MOLDED ARTICLE, ELECTROCONDUCTIVE PATTERN, ELECTRONIC CIRCUIT, AND ELECTROMAGNETIC SHIELD

#4 | 2017-06-08

US20170158857A1

Chemistry; metallurgy

ULTRAVIOLET CURABLE COMPOSITION

#5 | 2016-12-22

US20160369106A1

Chemistry; metallurgy

Aqueous coating agent and article using same

#6 | 2016-07-07

US20160198594A1

CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD, AND METHOD FOR PRODUCING CONDUCTIVE PATTERN

#7 | 2016-02-25

US20160053146A1

Chemistry; metallurgy

Urethane resin composition, coating agent, and article

#8 | 2016-02-04

US20160037632A1

Laminate, conductive pattern, and method for producing laminate

#9 | 2015-12-10

US20150359095A1

Laminate, conductive pattern, electrical circuit, and method for producing laminate

#10 | 2015-12-10

US20150353747A1

Chemistry; metallurgy

Absorbing-layer-forming composition and absorbing substrate, printed item, conductive pattern, and electric circuit produced using the same

#11 | 2015-03-12

US20150068907A1

LAMINATE, CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, AND METHOD FOR PRODUCING LAMINATE

#12 | 2015-03-05

US20150060132A1

CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD, AND METHOD FOR PRODUCING CONDUCTIVE PATTERN

#13 | 2014-07-24

US20140202749A1

RESIN COMPOSITION FOR FORMING INK-RECEIVING LAYER AND INK-RECEIVING BASE, PRINTED MATTER AND CONDUCTIVE PATTERN PRODUCED BY USING THE RESIN COMPOSITION

#14 | 2014-05-29

US20140144684A1

CONDUCTIVE PATTERN AND METHOD FOR PRODUCING THE SAME

#15 | 2013-10-03

US20130260114A1

Chemistry; metallurgy

Resin composition for forming receiving layer, and receiving substrate; printed matter, conductive pattern, and electric circuit produced by using the resin composition

#16 | 2013-08-29

US20130220681A1

Performing operations; transporting

RESIN COMPOSITION FOR FORMING RECEIVING LAYER, AND RECEIVING SUBSTRATE; PRINTED MATTER, CONDUCTIVE PATTERN, AND ELECTRIC CIRCUIT PRODUCED BY USING THE RESIN COMPOSITION

#17 | 2011-09-01

US20110212332A1

Chemistry; metallurgy

AQUEOUS HYBRID RESIN COMPOSITION, COATING PREPARATION CONTAINING THE SAME, AND LAMINATE THEREWITH

#18 | 2011-05-05

US20110104405A1

Performing operations; transporting

Inkjet receiving agent for oil-based pigment ink, inkjet recording medium for oil based pigment ink, and printed material

#19 | 2010-10-28

US20100273930A1

Chemistry; metallurgy

Coating agent and method for production thereof

InventorID:

408570 ⎘