D. J. Perng

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2008-06-05

Top Assignees for applications by D. J. Perng

The entities that hold a legal rights for patent applications filed by inventor Perng D. J.:

D. J. Perng from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

ESD structure for high voltage ESD protection

Semiconductor package substrate for flip chip packaging

InventorID:

4087589 ⎘