Brookfield, Connecticut
United States
9
2008-08-28
The entities that hold a legal rights for patent applications filed by inventor Nye Henry A.:
Henry A. Nye from Brookfield, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#2 | 2008-08-28Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#3 | 2008-08-28INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
#4 | 2008-01-17Structure and method of chemically formed anchored metallic vias
#5 | 2008-01-10Ball Limiting Metallurgy, Interconnection Structure Including the Same, and Method of Forming an Interconnection Structure
#6 | 2005-10-27Immersion plating and plated structures
#7 | 2005-10-13Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#8 | 2005-06-02Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
#9 | 2005-02-03Inhibition of tin oxide formation in lead free interconnect formation
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