Michael Ryan Ng

City:

Burlingame, California

Country:

United States

Published Applications:

Last publication date:

2013-08-29

Top Assignees for applications by Michael Ryan Ng

The entities that hold a legal rights for patent applications filed by inventor Ng Michael Ryan:

Michael Ryan Ng from Burlingame, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of reducing solder wicking on a substrate

Method of reducing solder wicking on a substrate

Substrate with via and pad structures

InventorID:

409221 ⎘