Hsinchu
Taiwan
14
2026-05-14
The entities that hold a legal rights for patent applications filed by inventor Yang Su-Chun:
Su-Chun Yang from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
#2 | 2025-12-04SEMICONDUCTOR PACKAGE AND METHOD
#3 | 2025-11-27WAFER FORMATION AND PROCESSING METHOD
#4 | 2025-10-02BONDING WITH PRE-DEOXIDE PROCESS AND APPARATUS FOR PERFORMING THE SAME
#5 | 2025-09-04WAVEGUIDES AND METHODS OF FORMING THE SAME
#6 | 2025-08-14OPTICAL DEVICE AND METHOD OF MANUFACTURE
#7 | 2025-02-13OPTICAL DEVICES AND METHODS OF MANUFACTURE
#8 | 2025-01-23INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
#9 | 2024-11-07EDGE FILL FOR STACKED STRUCTURE
#10 | 2022-09-08Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
#11 | 2019-10-24Bonding with pre-deoxide process and apparatus for performing the same
#12 | 2018-01-11Thinning process using metal-assisted chemical etching
#13 | 2017-01-12Solder bump stretching method for forming a solder bump joint in a device
#14 | 2013-08-29Solder bump joint in a device including lamellar structures
409856 ⎘