Bedford, Massachusetts
United States
12
2022-04-14
The entities that hold a legal rights for patent applications filed by inventor Hollis Ernest E.:
Ernest E. Hollis from Bedford, US has applied for patents for these inventions. The list has both pending applications and granted patents:
HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
#2 | 2021-05-13High speed, high density, low power die interconnect system
#3 | 2021-05-13HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
#4 | 2018-07-12High speed, high density, low power die interconnect system
#5 | 2017-03-16High speed, high density, low power die interconnect system
#6 | 2017-02-02High speed, high density, low power die interconnect system
#7 | 2016-07-28High speed, high density, low power die interconnect system
#8 | 2013-09-05High speed, high density, low power die interconnect system
#9 | 2013-08-29High speed, high density, low power die interconnect system
#10 | 2011-10-20High speed, high density, low power die interconnect system
#11 | 2011-10-20High speed, high density, low power die interconnect system
#12 | 2008-01-24High speed, high density, low power die interconnect system
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