Jochen Kraft

Method of producing a semiconductor device with protruding contacts

Semiconductor device with integrated mirror and method of producing a semiconductor device with integrated mirror

Semiconductor device with through-substrate via and corresponding method of manufacture

Semiconductor device with optical and electrical vias

METHOD OF APPLICATION OF A CARRIER TO A DEVICE WAFER

Interposer-chip-arrangement for dense packaging of chips

Semiconductor device with internal substrate contact and method of production

Photodiode and production method

Method for producing a semiconductor device comprising a conductor layer in the semiconductor body and semiconductor body

Method of producing a semiconductor device having an interconnect through the substrate

Method for producing a semiconductor component with a through-contact and semiconductor component with through-contact

Method of producing a semiconductor device and semiconductor device having a through-wafer interconnect

Method for producing a semiconductor component, and semiconductor component

Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection

Semiconductor device and a method for making the semiconductor device

Photodiode with a reduced dark current and method for the production thereof

Light-sensitive component with increased blue sensitivity, method for the production thereof, and operating method

Light-sensitive component

Method for the production of a bipolar transistor comprising an improved base terminal

Semiconductor body comprising a transistor structure and method for producing a transistor structure