Boise, Idaho
United States
15
2010-02-02
The entities that hold a legal rights for patent applications filed by inventor Johnson Mark S.:
Mark S. Johnson from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Overmolding encapsulation process and encapsulated article made therefrom
#2 | 2008-01-31Plating buss and a method of use thereof
#3 | 2006-12-19Semiconductor package having exposed heat dissipating surface and method of fabrication
#4 | 2006-11-16Plating buss and a method of use thereof
#5 | 2006-11-07Microelectronic component assemblies and microelectronic component lead frame structures
#6 | 2006-10-12Plating buss and a method of use thereof
#7 | 2006-09-14Stacked microfeature devices
#8 | 2006-02-23Conductive structures for microfeature devices and methods for fabricating microfeature devices
#9 | 2005-12-08Plating buss and a method of use thereof
#10 | 2005-11-10Method and apparatus for forming structures proximate to workpieces
#11 | 2005-10-04Asymmetric transfer molding method and an asymmetric encapsulation made therefrom
#12 | 2005-07-21Microelectronic component assemblies and microelectronic component lead frame structures
#13 | 2005-07-21Microelectronic component assemblies and microelectronic component lead frame structures
#14 | 2005-06-21Stereolithographic method and apparatus for packaging electronic components
#15 | 2005-03-03Stacked microfeature devices and associated methods
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