Inventor profile of:

David Johnson

City:

Palm Harbor, Florida

Country:

United States

Published Applications:

17

Last publication date:

2008-06-26

Top Assignees for applications by David Johnson

The entities that hold a legal rights for patent applications filed by inventor Johnson David:

Recent patent applications by Johnson David

David Johnson from Palm Harbor, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2008-06-26
US20080149597A1
Electricity

Temperature control method for photolithographic substrate

#2 | 2008-03-13
US20080061029A1
Performing operations; transporting

Method for plasma etching of positively sloped structures

#3 | 2008-02-14
US20080035606A1
Chemistry; metallurgy

Method to minimize CD etch bias

#4 | 2007-09-20
US20070217119A1
Performing operations; transporting

Apparatus and Method for Carrying Substrates

#5 | 2007-08-02
US20070175856A1
Electricity

Notch-Free Etching of High Aspect SOI Structures Using A Time Division Multiplex Process and RF Bias Modulation

#6 | 2007-02-22
US20070039548A1
Physics

Optical emission interferometry for PECVD using a gas injection hole

#7 | 2006-10-03
US10815965
-

Method and apparatus for process control in time division multiplexed (TDM) etch process

#8 | 2006-09-05
US10841818
-

Envelope follower end point detection in time division multiplexed processes

#9 | 2006-04-06
US20060070703A1
Electricity

Method and apparatus to improve plasma etch uniformity

#10 | 2006-01-12
US20060006139A1
Physics

Selection of wavelengths for end point in a time division multiplexed process

#11 | 2006-01-03
US10770839
-

End point detection in time division multiplexed etch processes

#12 | 2005-12-29
US20050287815A1
Electricity

Method and apparatus for reducing aspect ratio dependent etching in time division multiplexed etch processes

#13 | 2005-12-01
US20050263485A1
Physics

Method and apparatus for process control in time division multiplexed (TDM) etch processes

#14 | 2005-08-02
US10640469
-

Sidewall smoothing in high aspect ratio/deep etching using a discrete gas switching method

#15 | 2005-06-14
US10601076
-

Notch-free etching of high aspect SOI structures using alternating deposition and etching and pulsed plasma

#16 | 2005-05-26
US20050112891A1
Electricity

Notch-free etching of high aspect SOI structures using a time division multiplex process and RF bias modulation

#17 | 2005-01-25
US10407831
-

Method for etching vias

InventorID:

4114910 ⎘