David M. Otterson

City:

Washington, District of Columbia

Country:

United States

Published Applications:

Last publication date:

2008-02-14

Top Assignees for applications by David M. Otterson

The entities that hold a legal rights for patent applications filed by inventor Otterson David M.:

Surface Treatment Technologies, Inc. 1 Halethorpe, MD United States

Recent patent applications by Otterson David M.

David M. Otterson from Washington, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2008-02-14

US20080038149A1

Chemistry; metallurgy

Thermal deposition of reactive metal oxide/aluminum layers and dispersion strengthened aluminides made therefrom

InventorID:

4116875 ⎘