Patents-Review.com
🔗 Permalink
Inventor profile of:

Michael B. Ball

City:

Boise, Idaho

Country:

United States

Published Applications:

24

Last publication date:

2009-12-22

Top Assignees for applications by Michael B. Ball

The entities that hold a legal rights for patent applications filed by inventor Ball Michael B.:

Recent patent applications by Ball Michael B.

Michael B. Ball from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-12-22
US9576727
-

System for locating conductive sphere utilizing screen and hopper of solder balls

 #2 | 2008-02-21
US20080044985A1
Electricity

Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods

 #3 | 2007-05-24
US20070117266A1
Electricity

Method of fabricating a multi-die semiconductor package assembly

 #4 | 2007-01-23
US8602503
-

Method of fabricating a multi-die semiconductor package assembly

 #5 | 2006-11-07
US10635843
-

Methods for lead penetrating clamping system

 #6 | 2006-09-12
US10357825
-

Method of locating conductive spheres utilizing screen and hopper of solder balls

 #7 | 2006-07-20
US20060157532A1
Electricity

Apparatus of clamping semiconductor devices using sliding finger supports

 #8 | 2006-06-08
US20060121645A1
Electricity

Method of fabrication of stacked semiconductor devices

 #9 | 2006-02-09
US20060027624A1
Electricity

Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux

 #10 | 2006-01-03
US10639121
-

Apparatus of clamping semiconductor devices using sliding finger supports

 #11 | 2005-10-25
US10358849
-

Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux

 #12 | 2005-10-18
US9526814
-

Apparatus for routing die interconnections using intermediate connection elements secured to the die face

 #13 | 2005-09-27
US9854759
-

Using backgrind wafer tape to enable wafer mounting of bumped wafers

 #14 | 2005-06-30
US20050142835A1
Electricity

Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed

 #15 | 2005-05-12
US20050098887A1
Electricity

Using backgrind wafer tape to enable wafer mounting of bumped wafers

 #16 | 2005-05-03
US10200899
-

Device and method for clamping and wire-bonding the leads of a lead frame one set at a time

 #17 | 2005-04-26
US9422887
-

Angularly offset stacked die multichip device and method of manufacture

 #18 | 2005-03-17
US20050056682A1
Electricity

Method of locating conductive spheres utilizing screen and hopper of solder balls

 #19 | 2005-03-17
US20050056681A1
Electricity

Apparatus for locating conductive spheres utilizing screen and hopper of solder balls

 #20 | 2005-03-01
US9736795
-

Method of disposing conductive bumps onto a semiconductor device

 #21 | 2005-01-25
US10633922
-

Bondhead lead clamp apparatus

 #22 | 2005-01-18
US10358630
-

Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux

 #23 | 2005-01-13
US20050009236A1
Electricity

Method of fabrication of stacked semiconductor devices

 #24 | 2005-01-04
US10633897
-

Bondhead lead clamp apparatus and method
InventorID:

4122693 ⎘