Eagle, Idaho
United States
10
2010-07-13
The entities that hold a legal rights for patent applications filed by inventor Jackson Timothy L.:
Timothy L. Jackson from Eagle, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Stacked die module including multiple adhesives that cure at different temperatures
#2 | 2008-06-26SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS
#3 | 2008-02-28Thin flip-chip method
#4 | 2007-05-15Stacked die module and techniques for forming a stacked die module
#5 | 2006-04-18Stacked die module and techniques for forming a stacked die module
#6 | 2006-03-23Stacked die module and techniques for forming a stacked die module
#7 | 2005-11-08Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof
#8 | 2005-09-22Thin flip-chip method
#9 | 2005-08-25Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods
#10 | 2005-06-14Thin flip-chip method
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