Jaehak Kim

City:

Fishkill, New York

Country:

United States

Published Applications:

Last publication date:

2008-03-06

Top Assignees for applications by Jaehak Kim

The entities that hold a legal rights for patent applications filed by inventor Kim Jaehak:

Jaehak Kim from Fishkill, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Methods of forming dual-damascene interconnect structures using adhesion layers having high internal compressive stresses

InventorID:

4132684 ⎘