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Inventor profile of:

Tetsuya KOSUGI

City:

Toyama

Country:

Japan

Published Applications:

26

Last publication date:

2025-07-24

Top Assignees for applications by Tetsuya KOSUGI

The entities that hold a legal rights for patent applications filed by inventor KOSUGI Tetsuya:

HITACHI KOKUSAI ELECTRIC INC. 15 Tokyo, Japan
KOKUSAI ELECTRIC CORPORATION 13 Tokyo, Japan
KOKUSAI ELECTRIC CORPORATION 1 Toyko, Japan

Recent patent applications by KOSUGI Tetsuya

Tetsuya KOSUGI from Toyama, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-07-24

US20250239472A1

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, TEMPERATURE METER AND HEATER UNIT

#2 | 2025-07-17

US20250232993A1

Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium

#3 | 2024-07-04

US20240222160A1

CEILING HEATER, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING APPARATUS

#4 | 2022-03-17

US20220082447A1

Substrate processing apparatus, and thermocouple

#5 | 2021-10-07

US20210313205A1

Substrate processing apparatus, method of manufacturing semiconductor device and heater

#6 | 2020-12-17

US20200393197A1

Mechanical engineering

Heater, temperature control system, and processing apparatus

#7 | 2020-10-22

US20200333766A1

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND CONTROL PROGRAM

#8 | 2020-05-28

US20200166413A1

Substrate processing apparatus, and thermocouple

#9 | 2019-11-21

US20190355630A1

Substrate processing apparatus, method of manufacturing semiconductor device, and thermocouple support

#10 | 2019-09-19

US20190284696A1

Chemistry; metallurgy

Substrate processing apparatus and ceiling heater

#11 | 2019-03-14

US20190080941A1

Cooling unit, heat insulating structure, and substrate processing apparatus

#12 | 2018-11-15

US20180328790A1

Substrate processing apparatus, and thermocouple

#13 | 2018-02-08

US20180040520A1

Substrate processing apparatus, method of manufacturing semiconductor device, and thermocouple support

#14 | 2016-12-29

US20160376701A1

Chemistry; metallurgy

Substrate processing apparatus including heating and cooling device, and ceiling part included in the same

#15 | 2016-08-25

US20160245704A1

Substrate processing apparatus, and thermocouple

#16 | 2015-08-06

US20150221532A1

Substrate processing apparatus, heating apparatus, ceiling heat insulator, and method of manufacturing semiconductor device

#17 | 2015-04-02

US20150093909A1

Chemistry; metallurgy

Substrate processing apparatus, method of manufacturing semiconductor device and method of processing substrate

#18 | 2014-11-20

US20140342474A1

Temperature detecting apparatus, substrate processing apparatus and method of manufacturing semiconductor device

#19 | 2014-10-30

US20140322926A1

Method of manufacturing semiconductor device using meander-shaped heating element

#20 | 2014-09-25

US20140287375A1

Mechanical engineering

Insulation structure and method of manufacturing semiconductor device

#21 | 2013-01-17

US20130017628A1

Temperature detecting apparatus, substrate processing apparatus and method of manufacturing semiconductor device

#22 | 2012-01-12

US20120006506A1

Substrate processing apparatus and heating equipment

#23 | 2011-11-17

US20110281226A1

Heater supporting device

#24 | 2011-01-27

US20110021039A1

Heating device, substrate processing apparatus, and method of manufacturing semiconductor device

#25 | 2011-01-27

US20110021038A1

Heating device having a meander-shaped heating element with an insulating body accomodating the same, and the substrate processing apparatus including the same

#26 | 2009-08-20

US20090209113A1

Chemistry; metallurgy

Substrate processing apparatus, method of manufacturing semiconductor device, and ceiling insulating part

InventorID:

41397 ⎘