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Inventor profile of:

Chan Kim Lee

City:

Country:

United States

Published Applications:

1

Last publication date:

2008-03-20

Recent patent applications by Lee Chan Kim

Chan Kim Lee from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2008-03-20

US20080067665A1

Via structure

InventorID:

4140420 ⎘