Inventor profile of:

Pierre Caubet

City:

Le Versoud

Country:

France

Published Applications:

15

Last publication date:

2017-09-07

Top Assignees for applications by Pierre Caubet

The entities that hold a legal rights for patent applications filed by inventor Caubet Pierre:

Recent patent applications by Caubet Pierre

Pierre Caubet from Le Versoud, FR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-09-07
US20170256625A1
Electricity

Process for forming a layer of equiaxed titanium nitride and a MOSFET device having a metal gate electrode including a layer of equiaxed titanium nitride

#2 | 2017-06-22
US20170179250A1
Electricity

Process for forming a layer of equiaxed titanium nitride and a MOSFET device having a metal gate electrode including a layer of equiaxed titanium nitride

#3 | 2015-07-16
US20150200099A1
Electricity

Transistor having a gate comprising a titanium nitride layer and method for depositing this layer

#4 | 2015-04-30
US20150117128A1
Physics

Optoelectronic device, in particular memory device

#5 | 2014-10-30
US20140319616A1
Electricity

Method for producing a metal-gate MOS transistor, in particular a PMOS transistor, and corresponding integrated circuit

#6 | 2014-04-10
US20140097504A1
Electricity

Method for depositing a low-diffusion TiAlN layer and insulated gate comprising such a layer

#7 | 2013-01-03
US20130001708A1
Electricity

Transistors having a gate comprising a titanium nitride layer

#8 | 2010-06-24
US20100155950A1
Electricity

Implementation of a metal barrier in an integrated electronic circuit

#9 | 2010-06-03
US20100133634A1
Electricity

Production of a self-aligned CuSiN barrier

#10 | 2010-05-06
US20100108867A1
Electricity

Integrated electrooptic system

#11 | 2009-01-08
US20090008531A1
Electricity

Integrated electrooptic system

#12 | 2008-11-27
US20080290417A1
Electricity

Electronic component comprising a titanium carbonitride (TiCN) barrier layer and process of making the same

#13 | 2008-04-17
US20080088022A1
Electricity

Implementation of a metal barrier in an integrated electronic circuit

#14 | 2007-02-15
US20070035029A1
Electricity

Production of a self-aligned CuSiN barrier

#15 | 2006-03-23
US20060060976A1
Electricity

Process for forming integrated circuit comprising copper lines

InventorID:

4144 ⎘