Inventor profile of:

Michael J. DANEMAN

City:

Campbell, California

Country:

United States

Published Applications:

13

Last publication date:

2018-12-06

Top Assignees for applications by Michael J. DANEMAN

The entities that hold a legal rights for patent applications filed by inventor DANEMAN Michael J.:

Recent patent applications by DANEMAN Michael J.

Michael J. DANEMAN from Campbell, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-12-06
US20180346323A1
Performing operations; transporting

Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices

#2 | 2018-11-01
US20180312394A1
Performing operations; transporting

MEMS device and process for RF and low resistance applications

#3 | 2017-11-16
US20170327370A1
Performing operations; transporting

ALUMINUM NITRIDE (AlN) DEVICES WITH INFRARED ABSORPTION STRUCTURAL LAYER

#4 | 2017-10-19
US20170297900A1
Performing operations; transporting

MEMS device and process for RF and low resistance applications

#5 | 2017-01-26
US20170022054A1
Performing operations; transporting

Aluminum nitride (AlN) devices with infrared absorption structural layer

#6 | 2017-01-19
US20170015547A1
Performing operations; transporting

Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices

#7 | 2016-03-10
US20160068388A1
Performing operations; transporting

Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices

#8 | 2015-10-22
US20150298965A1
Performing operations; transporting

Aluminum nitride (AlN) devices with infrared absorption structural layer

#9 | 2014-05-29
US20140145244A1
Performing operations; transporting

MEMS device and process for RF and low resistance applications

#10 | 2013-10-22
US13754462
-

Internal electrical contact for enclosed MEMS devices

#11 | 2013-01-03
US20130001710A1
Electricity

PROCESS FOR A SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT

#12 | 2012-09-20
US20120235297A1
Human necessities

MEMS device including an electrical interconnect through a substrate

#13 | 2012-09-20
US20120235251A1
Human necessities

WAFER LEVEL PACKAGING OF MEMS DEVICES

InventorID:

4147 ⎘