Christoph Schelling

METHOD FOR PRODUCING A MICROMECHANICAL LAYER STRUCTURE WITH HIGH ASPECT RATIO AND MICROMECHANICAL LAYER STRUCTURE

PIEZOELECTRIC MATERIALS, DEVICES AND METHODS OF FABRICATING SAID DEVICES

STRAINED PIEZOELECTRIC DEVICES FOR RADIOFREQUENCY RESONATORS AND FABRICATION METHODS THEREOF

VOLUME ACOUSTIC DEVICE AND METHOD FOR PRODUCING A VOLUME ACOUSTIC DEVICE

VOLUME ACOUSTIC DEVICE AND METHOD FOR PRODUCING A VOLUME ACOUSTIC DEVICE

MEMS COMPONENT

MICROELECTROMECHANICAL DEVICE, MICROELECTROMECHANICAL PRESSURE SENSOR, MICROELECTROMECHANICAL MICROPHONE AND MICROELECTROMECHANICAL COMBINATION SENSOR ELEMENT.

HIGH-FREQUENCY FILTER DEVICE, HIGH-FREQUENCY MODULE, AND HIGH-FREQUENCY FILTER METHOD

MEMS TRANSDUCER, IN PARTICULAR FOR INTERACTING WITH A FLUID

COMPUTATIONAL METHODS FOR PREDICTING ADHESION CHARACTERISTICS OF MOLECULAR COATINGS

MICROMECHANICAL DIAPHRAGM SYSTEM

MICROELECTROMECHANICAL COMPONENT

MICROELECTROMECHANICAL ACOUSTIC COMPONENT

METHOD FOR OPERATING A SEMICONDUCTOR GAS SENSOR, AND SEMICONDUCTOR GAS SENSOR

CONVERTER UNIT FOR ELECTRICAL AND/OR ACOUSTIC SIGNALS AND/OR RELATIVE PRESSURES

MEMS Device for Interaction with Fluids

MEMS Device for Interaction with Fluids

Method for producing a nanoscale channel structure

Mirror Device for an Interferometer Device, Interferometer Device and Method for Producing a Mirror Device

Spectrometer device and method for producing a spectrometer device

MEMS optical switch with a cantilever coupler

MEMS optical switch with stop control

In-plane MEMS optical switch

Lidar Module With Monolithic Array

Interferometer Device and Method for Producing an Interferometer Device

Readout signal generator and method for operating a capacitive device

Interferometer element, spectrometer and method for operating an interferometer

Interferometer and method for producing an interferometer

Spectrometer device and method for producing a spectrometer device

Micromechanical mirror device, mirror system, and method for producing a micromechanical mirror device

Micromechanical sensor device with improved liquid tightness protection

Micromechanical sensor that includes a stress decoupling structure

Method for producing a conductive through-plating for a substrate as well as conductive through-plating

Micromechanical component

MANUFACTURING METHOD FOR A MICROMECHANICAL DEVICE INCLUDING AN OBLIQUE SURFACE AND CORRESPONDING MICROMECHANICAL DEVICE

Micromechanical sensor

MEMS component having low-resistance wiring and method for manufacturing it

MEMS component

MEMS LOUDSPEAKER DEVICE AND CORRESPONDING MANUFACTURING METHOD

Sensor unit including a decoupling structure and manufacturing method therefor

Device for Detecting a Parameter of a Gas, Method for Operating Such a Device, and Measuring System for Determining a Parameter of a Gas

MEMS component including a sound-pressure-sensitive diaphragm element and piezosensitive signal detection

MEMS component including a diaphragm element which is attached via a spring structure to the component layer structure

MEMS component including a sound-pressure-sensitive diaphragm element

Micromechanical sound transducer system and a corresponding manufacturing method

Component having a micromechanical microphone pattern

Circuit board for a microphone component part, and microphone module having such a circuit board

Micro heating plate device and sensor having a micro heating plate device

Micromechanical sensor device and corresponding production method

Method for producing a micromechanical component, and corresponding micromechanical component

Micromechanical component having a diaphragm structure

Thermodiode Element for a Photosensor for Infrared Radiation Measurement, Photosensor and Method for producing a Thermodiode Element

Micromechanical sensor system combination and a corresponding manufacturing method

Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements

ASIC element, in particular as a component of a vertically integrated hybrid component

Method for producing a multi-layer electrode system

COMPONENT HAVING A MICROPHONE AND MEDIA SENSOR FUNCTION

Microphone element and device for detecting acoustic and ultrasound signals

Infrared sensor device and method for producing an infrared sensor device

Infrared sensor device and method for producing an infrared sensor device

Membrane arrangement for a microelectromechanical measuring transducer and method for producing a membrane arrangement

Capacitive MEMS element including a pressure-sensitive diaphragm

MEMS component

Infrared sensor with acceleration sensor and method for operating an infrared sensor

MEMS device having a microphone structure, and method for the production thereof

MEMS structural component including a deflectable diaphragm and a fixed counter-element as well as a method for manufacturing it

Component having a micromechanical microphone pattern

component having a micromechanical microphone structure

Micromechanical acceleration sensor having conductor tracks and cavities

MEMS component

Manufacturing method for a micromechanical component and a corresponding micromechanical component

Component having a micromechanical microphone structure

Component and method for producing same

Image pixel apparatus for detecting electromagnetic radiation, sensor array for detecting electromagnetic radiation and method for detecting electromagnetic radiation by means of an image pixel apparatus

Component having a micromechanical microphone structure

MICROELECTROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT

Production process for a micromechanical component and micromechanical component

Semiconductor device with embedded converter element and production method for a semiconductor device with an embedded converter element

Microelectronic component and corresponding production process

Vertical microelectronic component and corresponding production method

Component part and method for testing such a component part

Bonding pad for thermocompression bonding, process for producing a bonding pad and component

METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, AND BONDING PAD

Component having a micromechanical microphone pattern

Sensor, method for producing a sensor and method for mounting a sensor

Component having a micromechanical microphone structure

Eutectic bonding of thin chips on a carrier substrate

Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component

METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE, AND A CORRESPONDING SEMICONDUCTOR STRUCTURE

Micromechanical component and method for manufacturing a micromechanical component

Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component

Micromechanical component having an inclined structure and corresponding manufacturing method

Method for manufacturing a plurality of thin chips and correspondingly manufactured thin chip

Sensor and method for its production

Method for producing a component, and sensor element

Method for manufacturing a micromechanical chip and a component having a chip of this type

Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type

Micromechanical structure for receiving and/or generating acoustic signals, method for producing a micromechanical structure, and use of a micromechanical structure

Method for manufacturing a semiconductor structure, and a corresponding Semiconductor Structure

Micromechanical diaphragm sensor having a double diaphragm