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Inventor profile of:

Kensuke ISHIKAWA

City:

Ome

Country:

Japan

Published Applications:

18

Last publication date:

2019-08-08

Top Assignees for applications by Kensuke ISHIKAWA

The entities that hold a legal rights for patent applications filed by inventor ISHIKAWA Kensuke:

Renesas Technology Corp. 6 Tokyo, Japan
RENESAS ELECTRONICS CORPORATION 5 Kawasaki-shi, Japan
RENESAS ELECTRONICS CORPORATION 3 Tokyo, Japan
Renesas Electronics Corporation 2 Tokyo, -
RENESAS ELECTRONICS CORP. 1 Tokyo, Japan
Renesas Electronics Corporation 1 Kawasaki-shi, South Korea

Recent patent applications by ISHIKAWA Kensuke

Kensuke ISHIKAWA from Ome, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-08-08

US20190244855A1

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#2 | 2019-01-31

US20190035678A1

Semiconductor device and manufacturing method thereof

#3 | 2018-02-15

US20180047620A1

Semiconductor device and manufacturing method thereof

#4 | 2017-07-13

US20170200637A1

Semiconductor device and manufacturing method thereof

#5 | 2017-01-12

US20170011994A1

Semiconductor device and manufacturing method thereof

#6 | 2015-08-20

US20150235962A1

Semiconductor device and manufacturing method thereof

#7 | 2014-10-23

US20140312499A1

Semiconductor device and manufacturing method thereof

#8 | 2014-04-03

US20140091468A1

Semiconductor device and manufacturing method thereof

#9 | 2013-08-29

US20130224947A1

Semiconductor device and manufacturing method thereof

#10 | 2012-01-19

US20120015514A1

Semiconductor device and manufacturing method thereof

#11 | 2009-10-15

US20090256261A1

Semiconductor device and manufacturing method thereof

#12 | 2009-05-07

US20090115063A1

Semiconductor integrated circuit device and a method of manufacturing the same

#13 | 2008-01-29

US10807222

Semiconductor device and manufacturing method thereof

#14 | 2006-10-12

US20060226555A1

Semiconductor device and manufacturing method thereof

#15 | 2006-09-28

US20060216925A1

Semiconductor integrated circuit device and a method of manufacturing the same

#16 | 2006-08-22

US10263829

Semiconductor integrated circuit device with a connective portion for multilevel interconnection

#17 | 2006-03-28

US10327024

Method of manufacturing a semiconductor integrated circuit device including a hole formed in an insulating film and a first conductive film formed over a bottom region and sidewalls of the hole

#18 | 2005-01-04

US10437900

Semiconductor device

InventorID:

415273 ⎘