Heng Keong Yip

City:

Selangor Darul Ehsan

Country:

Malaysia

Published Applications:

Last publication date:

2008-05-01

Top Assignees for applications by Heng Keong Yip

The entities that hold a legal rights for patent applications filed by inventor Yip Heng Keong:

FREESCALE SEMICONDUCTOR, INC 4 Austin, TX United States

Recent patent applications by Yip Heng Keong

Heng Keong Yip from Selangor Darul Ehsan, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2008-05-01

US20080099784A1

Electricity

Array quad flat no-lead package and method of forming same

#2 | 2007-12-06

US20070281393A1

Electricity

METHOD OF FORMING A TRACE EMBEDDED PACKAGE

#3 | 2007-11-01

US20070254409A1

Electricity

Method of forming stackable package

#4 | 2007-09-06

US20070207605A1

Electricity

Method for forming reinforced interconnects on a substrate

#5 | 2007-06-07

US20070128766A1

Electricity

Method of making exposed pad ball grid array package

InventorID:

4164670 ⎘