Tae Sub BAE

City:

Suwon-si

Country:

South Korea

Published Applications:

Last publication date:

2008-05-01

Top Assignees for applications by Tae Sub BAE

The entities that hold a legal rights for patent applications filed by inventor BAE Tae Sub:

CHEIL INDUSTRIES INC. 3 Gumi-si, South Korea
Cheil Industries, Inc. 1 Gumi-shi, Gyungsangbuk-do, South Korea

Recent patent applications by BAE Tae Sub

Tae Sub BAE from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2008-05-01

US20080102277A1

Electricity

Conductive particles comprising complex metal layer with density gradient, method for preparing the particles, and anisotropic conductive adhesive composition comprising the particles

#2 | 2007-12-27

US20070295943A1

Electricity

Polymer particles and conductive particles having enhanced conducting properties, and anisotropic conductive packaging materials containing the same

#3 | 2007-11-01

US20070252112A1

Electricity

Polymer particles, conductive particles, and an anisotropic conductive packaging materials containing the same

#4 | 2007-03-15

US20070059503A1

Electricity

Insulated conductive particles and anisotropic conductive adhesive film containing the particles

#5 | 2006-11-23

US20060263581A1

Electricity

Insulated conductive particles and an anisotropic conductive film containing the particles

InventorID:

4166379 ⎘