San Jose, California
United States
27
2008-05-29
The entities that hold a legal rights for patent applications filed by inventor Warner Michael:
Michael Warner from San Jose, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Collective and synergistic MRAM shields
#2 | 2008-05-08Stackable electronic device assembly
#3 | 2007-09-11High-frequency chip packages
#4 | 2007-07-19Components, methods and assemblies for multi-chip packages
#5 | 2007-06-28Microelectronic elements with compliant terminal mountings and methods for making the same
#6 | 2007-06-21Stackable electronic device assembly and high G-force test fixture
#7 | 2007-05-03Back-face and edge interconnects for lidded package
#8 | 2007-05-03High frequency chip packages with connecting elements
#9 | 2007-02-13High frequency chip packages with connecting elements
#10 | 2006-12-12Stacked microelectronic assemblies
#11 | 2006-12-07Microelectronic assemblies having low profile connections
#12 | 2006-08-29Microelectronic assemblies having low profile connections
#13 | 2006-06-13Components, methods and assemblies for multi-chip packages
#14 | 2006-06-01Microelectronic assemblies incorporating inductors
#15 | 2006-05-25Microelectronic assemblies and methods of making microelectronic assemblies
#16 | 2006-03-14Microelectronic assemblies incorporating inductors
#17 | 2005-12-22Multi-frequency noise suppression capacitor set
#18 | 2005-11-01Methods of making microelectronic packages
#19 | 2005-09-01Packaged acoustic and electromagnetic transducer chips
#20 | 2005-09-01Packaged acoustic and electromagnetic transducer chips
#21 | 2005-08-04Method of making microelectronic packages including electrically and/or thermally conductive element
#22 | 2005-04-28Back-face and edge interconnects for lidded package
#23 | 2005-04-26Stacked microelectronic assemblies and methods of making same
#24 | 2005-03-29Methods of making microelectronic packages including electrically and/or thermally conductive element
#25 | 2005-03-24Connection components with anistropic conductive material interconnector
#26 | 2005-03-03High-frequency chip packages
#27 | 2005-02-15High-frequency chip packages
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